"The CADENCE solution enables us to enter up to 99% of signals in table format, which along with improved analytics and a unique integrated environment, reduces our PCB developed time by 80%"
Gisbert Thomke,
Group Leader,IBM R & D Lab
Germany.
"The automatic ground via placement function of the CADENCE ALLEGRO RF PCB module offers the most powerful support to RF PCB design, and significantly improves post processing efficiency.We achieved a 50% improvement in this area, and increased our overall design efficiency by 15%"
Yuan Wexin,
Engineer, Wireless
Interconnection Design Dept,
Huawei.
Gisbert Thomke,
Group Leader,IBM R & D Lab
Germany.
"The automatic ground via placement function of the CADENCE ALLEGRO RF PCB module offers the most powerful support to RF PCB design, and significantly improves post processing efficiency.We achieved a 50% improvement in this area, and increased our overall design efficiency by 15%"
Yuan Wexin,
Engineer, Wireless
Interconnection Design Dept,
Huawei.
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